MEDIA RELEASE PR35724
RAYSPAN Corporation Announces Grant of Fundamental Metamaterial Air Interface Patent
SAN DIEGO, Aug. 17 /PRNewswire-AsiaNet/ --
RAYSPAN Corporation, the world's leading innovator of metamaterial air
interface solutions, is proud to announce it has been granted a fundamental
patent, ANTENNAS BASED ON METAMATERIAL STRUCTURES. The sweeping claims of
this patent encompass a broad range of metamaterial inventions that make
possible RAYSPAN's breakthrough ultra-miniature antennas and related air
interface components and systems. With an intellectual property portfolio
that now includes over sixty-five awarded and pending domestic and
international patents covering the world's most advanced metamaterial
wireless technology, RAYSPAN has established an extremely strong foundation
for licensing and protecting its metamaterial solutions in the global
cellular handset and wireless LAN markets. This unmatched patent portfolio
protects the full span of RAYSPAN's fundamental enabling structures, antennas
and essential radio frequency (RF) components based on those structures, use
of those structures in key RF subsystems and systems, and complete end-to-end
communication networks.
The air interface breakthroughs enabled by RAYSPAN's metamaterial
technology include ultra-compact implementations for broadband and multi-band
antennas, filters, couplers, diplexers, and duplexers for all wireless LAN
and cellular handset applications. In addition, the unique properties of
metamaterials enable highly integrated solutions, extending from miniaturized
antenna arrays, including MIMO, to complete RF front-end systems.
"RAYSPAN's innovations continue to be key in successfully implementing
today's advanced broadband wireless applications on a large scale," said Dr.
Maha Achour, Founder and Chief Technical Officer of RAYSPAN, Inc. "RAYSPAN's
ability to solve key RF challenges using its proprietary metamaterial
solutions is testimony to the power of the technology it has developed and
its ability to surpass all competing solutions in size, performance, and ease
of integration. Without any doubt, RAYSPAN will remain a technology leader
through its continuous innovations across the whole RF front-end landscape."
About RAYSPAN and Metamaterials:
The mission of RAYSPAN Corporation is to research, develop, market and
license the world's leading portfolio of proprietary metamaterial wireless
air interface solutions. Metamaterials are composite materials engineered to
produce desired electromagnetic propagation behavior not found in natural
media. They make possible breakthrough advances in air interface
miniaturization, performance and integration while simultaneously reducing
costs and simplifying manufacturing.
The wireless air interface is an essential part of every wireless device
and is comprised of the antenna(s) and RF front-end components: filters,
switches, couplers, diplexers, duplexers and power amplifiers. Today's air
interface presents some of the most challenging system integration problems
facing the wireless industry. As new standards call for utilizing multiple
radio bands, complex modulation schemes and multiple modes and channels, as
in MIMO systems, the size and spacing requirements of the components that
comprise the interface make it virtually impossible to achieve compact mobile
terminal size while maintaining adequate system performance.
RAYSPAN's metamaterial air interface solutions decisively solve these
problems. They enable ultra-compact, multi-band, multi-mode and/or MIMO WLAN
devices and cellular handsets with superior communication speed, range and
mobility at reduced costs. These solutions address virtually all segments of
the WLAN and handset markets, and they can be implemented quickly and
inexpensively under RAYSPAN's licensing model.
"Always increase customers' product value, decrease their costs and
simplify their business process"
SOURCE: RAYSPAN Corporation
CONTACT: Brian Hurst,
VP of Sales & Marketing of RAYSPAN Corporation,
+1-858-259-9596, ext. 306,
bhurst@rayspan.com
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